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High Tech Equipment

IPB equipment is available for collaborative research between UConn researchers and students and industry partners, small, mid-sized and large companies, as well as entrepreneurs. For further information and other inquiries, please contact the respective research center director.

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Thermo Fisher Scientific Center for Advanced Microscopy and Materials Analysis (CAMMA)

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CENTER: CAMMA
Strata 400S Dual Beam
  • Dual beam systems uses electron beam for imaging and gallium ions for imaging and precise micromachining
  • High resolution imaging down to the nanometer level
FLYER
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CENTER: CAMMA
Helios 460F1 Dual Beam
  • Dual beam system uses electron beam for imaging and gallium ions for imaging and precise micromachining
  • High resolution imaging down to the sub-nanometer level
FLYER  
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CENTER: CAMMA
Helios PFIB Dual Beam
  • Dual beam system uses electron beam for imaging and xenon ions for imaging and precise micromachining
  • Large volume 3D characterization
FLYER
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CENTER: CAMMA
Aspex Explorer VP SEM
  • Easy operation in high and low vacuum mode facilitates imaging of any material
  • Auto-mode particle counting, measuring, and chemical identification requires no user input once initiated
FLYER
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CENTER: CAMMA
Teneo LV SEM
  • Unique detection system provides high contrast for a wide range of samples
  • Low vacuum mode allows analysis of insulating samples with no conductive coating
FLYER
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CENTER: CAMMA
Verios 460L SEM
  • High resolution imaging to the nanoscale with multiple detectors for topographic and compositional material information
  • High flexibility in loading samples gives additional options for analyses
FLYER
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CENTER: CAMMA
Tecnai T-12 TEM
  • Nanometer level imaging and elemental analysis
  • Variable accelerating voltage can be customized to suit sample sensitivity
FLYER  
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CENTER: CAMMA
Talos 200 S/TEM
  • Atomic resolution imaging and elemental analysis
  • Customized fittings available to perform in situ dynamic experiments in real time
FLYER
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CENTER: CAMMA
Titan Themis ACEM
  • Single atom resolution imaging and elemental analysis
  • Spherical aberration corrected for the highest spatial resolution
FLYER

Pratt & Whitney Additive Manufacturing Center (PW AMC)

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CENTER: PW AMC
Wire Electrical Discharge Machining
CNC controlled. Removes parts from the build plate and performs finish machining
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CENTER: PW AMC
MRF Arc Melter
MRF arc-melter with single-crystal pulling option, gas purification, oxygen monitoring, vacuum casting
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CENTER: PW AMC
Furnace Rheometer
Viscosity measurements of liquid metals and alloys
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CENTER: PW AMC
LECO CS 844
Carbon-sulfur impurity analyzer
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CENTER: PW AMC
LECO ONH 836
Oxygen-nitrogen-hydrogen impurity analyzer
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CENTER: PW AMC
TA Instruments ODP 868
Optical determination of thermal expansion, melting, and sample flexure to 1,600 degrees celsius
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CENTER: PW AMC
TA Instruments EM DLF1600/2800 (Laser Flash)
DLF 1600 with 2800 environmental module for thermal diffusivity measurements
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CENTER: PW AMC
Camsizer XT
Powder size and shape distribution analysis
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CENTER: PW AMC
3DSystems ProX300
Laser-based metal additive manufacturing machine
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CENTER: PW AMC
EOS M270
EOS laser sintering system for the production of tooling inserts, prototype parts and end products directly in metal
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CENTER: PW AMC
Arcam Electron Beam Melting A2X Machine
Capable of manufacturing large, complex metal parts at high temperatures
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CENTER: PW AMC
Gleeble 3500
Gleeble 3500 with high-temperature mobile conversion unit and HydraWedge mobile conversion unit
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CENTER: PW AMC
Pegasus DSC
Differential scanning calorimeter designed for determination of thermodynamic properties of ceramics and metallic high-performance materials.
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CENTER: PW AMC
Agilent ICP 770
Chemical analysis of inorganic materials
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CENTER: PW AMC
IPG Laser Printer SLM
Laser-based metal additive manufacturing machine with vacuum, pre-heating, fully open architecture and configurable hardware options.

Reverse Engineering Fabrication & Non-Destructive Evaluation (REFINE)

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CENTER: REFINE
Smartzoom 5
  • Automated digital microscope for QC and failure analysis
  • 2D and 3D imaging and measurement
FLYER
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CENTER: REFINE
Smartproof 5
  • Laser scanning confocal microscope for surface topography measurements
  • Allows for 10nm vertical resolution
FLYER
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CENTER: REFINE
Micrion Vectra 986+
  • Focused ion beam instrument with gas-assisted etching and beam-induced deposition
  • Enables IC circuit edit for debugging microchip designs and accessing internal data of security and encryption microcontrollers
FLYERS
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CENTER: REFINE
Orion Nanofab
  • Focus ion beam (FIB) microscope with helium and neon beams
  • Imaging resolution down to 5 angstroms and sub-10nm material removal
FLYER
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CENTER: REFINE
Crossbeam 340 w/ Laser
  • Scanning electron microscope with integrated gallium ion beam allowing nanometer precision material removal
  • Capable of 3D nanotomography, nanofabrication, and precise analytical analysis
FLYER
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CENTER: REFINE
Xradia MicroCT 400
  • X-ray computer tomography system
  • Complements Xradia Versa with lower energy limit, best suited for less dense materials
FLYER
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CENTER: REFINE
Xradia Versa 520
  • X-ray computed tomography with submicron resolution
  • Produces 3D data non-destructively allowing unparalleled insight into internal material structure and sample analysis
FLYER  

X-Ray Lab

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CENTER: X-Ray Lab
ZSX Primus IV XRF Spectrometer
  • Quick analysis of the major and minor elements (ppm)
  • Qualitative and quantitative determination from boron to uranium
  • Mapping and multi-point measurements
FLYER  
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CENTER: X-Ray Lab
SmartLab X-ray Diffraction System
  • Crystal structure of thin films, powders, and bulks
  • High power rotating anode and 2D detector
  • 10+ modes of analysis, i.e. GIXRD, XRR, residual stress, in-situ, and more
FLYER

Proof of Concept Center (POCC)

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CENTER: POCC
Universal Robot UR10e
Collaborative Robot 6 axis robotic arm with Robitiq Gripper
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CENTER: POCC
OMAX Protomax Waterjet
Cuts virtually any material up to 1 inch thick. 30 ksi pump pressure drives the fastest and most efficient cutting for its size
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CENTER: POCC
Universal Laser Systems ILS 12.150D
Dual laser platform capable of cutting and etching of many materials
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CENTER: POCC
Formlabs Form 2
SLA Benchtop 3D printer that uses a laser to cure solid isotropic parts from liquid photopolymer resin
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CENTER: POCC
Stratasys Design F370
Fusion deposition modeling 3D printer capable of creating complex, functional parts in ABS, PLA, ASA, and PC for prototyping, manufacturing jigs, fixtures and tools
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CENTER: POCC
Stratasys Connex350
Full color multi-material 3D printer capable of jetting multiple assembly of parts at 16 micron resolution
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CENTER: POCC
Haas CNC Lathe
For turning of small parts in metal, plastics, foam, and composites
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CENTER: POCC
Haas CNC Mill
3-axis machining center with tool changer. Capable of cutting metals, plastics, foams, and composites
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CENTER: POCC
3D Scanner and CMM probe
High resolution, large envelope 3D Scan Arm to output 3D scan models to popular design software like SolidWorks, Creo, 3DS Max, Rhino, and more.

Eversource Energy Center (EEC)

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CENTER: EEC
RTDS Testbed
Advanced Real-Time Digital Simulator (RTDS) testbed consisting of three NovaCor Chassis features IBM’s POWER8TM processor running at 3.5 GHz  that can conduct dynamic simulations for large-scale power systems with thousands of nodes in small timesteps in real time.